Areal Surface Texture Parameters for Copper/Glass Plating Adhesion Characteristics

He, BF; Webb, DP; Petzing, J

Petzing, J (corresponding author), Loughborough Univ, Wolfson Sch Mech & Mfg Engn, Loughborough LE11 3TU, Leics, England.

MEASUREMENT SCIENCE REVIEW, 2021; 21 (1): 11

Abstract

Glass as an alternative printed circuit board material and interposer has been investigated for use in the micro-electronics industry. Electroless cop......

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