投稿信息
投稿信息
审稿周期
投稿命中率
审稿费用
暂无数据
版面费用
暂无数据
中国人发表比例
2023年中国人文章占该期刊总数量暂无数据 (2022年为100.00%)
自引率
12.0 %
年文章数
2667
作者需知
暂无数据
NCBI查询
偏重的研究方向
暂无数据
期刊简介
稿件收录要求
稿件收录要求
A journal covering Microsensing, Microactuation, Micromechanics, Microdynamics, and Microelectromechanical Systems (MEMS). Contains articles on devices with dimensions that typically range from micrometers to millimeters, microfabrication techniques, microphenomena; microbearings, and microsystems; theoretical, computational, modeling and control results; new materials and designs; tribology; microtelemanipulation; and applications to biomedical engineering, optics, fluidics, etc. The Journal is jointly sponsored by EDS, the IEEE Industrial Electronics (IE) and Robotics and Automation (RA) societies and is a publication both of IEEE and The American Society of Mechanical Engineers (ASME).
