Micro-spall damage and subsequent re-compaction of release melted lead under shock loading-MedSci.cn

Micro-spall damage and subsequent re-compaction of release melted lead under shock loading

Wang, XX; Zhou, TT; Sun, ZY; Shi, XF; Sun, HQ; Zhang, FG; Yin, JW; He, AM; Wang, P

He, AM; Wang, P (通讯作者)，Inst Appl Phys & Computat Math, LCP, Beijing 100094, Peoples R China.

COMPUTATIONAL MATERIALS SCIENCE, 2022; 203 ():

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