Modeling of grinding chip thickness distribution based on material removel mode in grinding of SiC ceramics

Wu, CJ; Dong, WJ; Zhu, LJ; Zhang, J; Xu, LJ; Liang, SY

Wu, CJ (corresponding author), Donghua Univ, Coll Mech Engn, Shanghai 201620, Peoples R China.; Wu, CJ (corresponding author), Georgia Inst Technol, Mfg Res Ctr, Atlanta, GA 30332 USA.

JOURNAL OF ADVANCED MECHANICAL DESIGN SYSTEMS AND MANUFACTURING, 2020; 14 (1):

Abstract

Grinding chip thickness is an important parameter to reflect the grinding efficiency and investigate the grinding mechanism Modeling of the chip thick......

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