Fingerprinting shock-induced deformations via diffraction

Mishra, A; Kunka, C; Echeverria, MJ; Dingreville, R; Dongare, AM

Dongare, AM (corresponding author), Univ Connecticut, Dept Mat Sci & Engn, Storrs, CT 06269 USA.; Dongare, AM (corresponding author), Univ Connecticut, Inst Mat Sci, Storrs, CT 06269 USA.; Dingreville, R (corresponding author), Sandia Natl Labs, Ctr Integrated Nanotechnol, Albuquerque, NM 87123 USA.

SCIENTIFIC REPORTS, 2021; 11 (1):

Abstract

During the various stages of shock loading, many transient modes of deformation can activate and deactivate to affect the final state of a material. I......

Full Text Link