Mechanical properties and oxidation resistance of Sn-Zn-xCu (2.3 <= x <= 20.2) solder alloys prepared by high-throughput strategy

Geng, C; Jia, YD; Ma, XD; Jia, YF; Mu, YK; Wang, G; Li, CJ; Peng, JB; Bao, QH

Jia, YD (corresponding author), Shanghai Univ, Inst Mat, Lab Microstruct, Shanghai 200444, Peoples R China.; Li, CJ (corresponding author), Kunming Univ Sci & Technol, Fac Mat Sci & Engn, Kunming 650093, Yunnan, Peoples R China.

MANUFACTURING LETTERS, 2021; 27 (): 47

Abstract

Sn-Zn-Cu solder alloys are predominantly developed through a sequential and time-consuming trial-and-error approach. Here, it is presented that Cu-dop......

Full Text Link


Links

期刊讨论 | 中国SCI论文 | 期刊主页 | 投稿经验 | 杂志官网 | 投稿链接 | 作者需知 | PMC链接 | Pubmed全文检索