Elimination of Thermal Strain Interference in Mechanical Strain Measurement at High Temperature Using an EFPI-RFBG Hybrid Sensor With Unlimited Cavity Length

Nan, J; Zhang, DS; Wen, XY; Li, M; Lv, HF; Su, K

Wen, XY (corresponding author), Wuhan Univ Technol, Sch Sci, Wuhan 430070, Peoples R China.

IEEE SENSORS JOURNAL, 2020; 20 (10): 5270

Abstract

Mechanical strain measurement at high temperature is a challenge due to thermal strain interference caused by material thermal expansion. In this pape......

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