CU PASTE FOR MOLDED INTERCONNECT DEVICES

Ejiri, Y; Sukata, S; Toba, M; Urashima, K; Yonekura, M; Noudou, T; Kurihara, Y; Masuda, H

Ejiri, Y (reprint author), Hitachi Chem Co Ltd, Ibaraki, Japan.

2019 PAN PACIFIC MICROELECTRONICS SYMPOSIUM (PAN PACIFIC), 2019; ():

Abstract

Cu particles with an average particle size of 130 nm were found to be suitable for low-temperature metallization. Cu wirings with line/space (L/S) 150......

Full Text Link


Links

期刊讨论 | 中国SCI论文 | 期刊主页 | 投稿经验 | 杂志官网 | 投稿链接 | 作者需知 | PMC链接 | Pubmed全文检索