iPL-3D: A Novel Bilevel Programming Model for Die-to-Die Placement

Zhao, XY; Chen, SJ; Qiu, YH; Li, JK; Huang, ZP; Xie, BW; Li, XQ; Bao, YG

Huang, ZP (通讯作者),Chinese Acad Sci, Inst Comp Technol, State Key Lab Proc, Beijing, Peoples R China.;Huang, ZP (通讯作者),Peng Cheng Lab, Shenzhen, Peoples R China.

2023 IEEE/ACM INTERNATIONAL CONFERENCE ON COMPUTER AIDED DESIGN, ICCAD, 2023; ():

Abstract

Die-to-die (D2D) placement is a more challenging stage in achieving higher performance with complex constraints, critically impacting timing, power, y......

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