RF line impedance optimization methodology in laminate technologies

Monnier, T; Danaie, S; Schwartz, L

Monnier, T (reprint author), STMicroelectronics, ADL Silicon Packaging, Grenoble, France.

2019 23RD IEEE WORKSHOP ON SIGNAL AND POWER INTEGRITY (SPI 2019), 2019; ():

Abstract

Impedance matching is a fundamental aspect of RF transmission lines. The signal reflections caused by mismatched impedances such as balls, bumps, vias......

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