New bending mode in SAQP Si fins and its mitigation

Sepulveda, A; Hellin, D; Zhang, LP; Kenis, K; Batuk, D; Baudot, S; Briggs, B; Mountsier, T; Barla, K; Morin, P; Sanchez, EA

Sepulveda, A (通讯作者)，Imec, B-3000 Leuven, Belgium.

MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2022; 141 ():

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