Micro-ECM of 3D micro-electrode for efficiently processing 3D micro-structure

Xu, B; Wu, XY; Lei, JG; Liang, X; Zhao, H; Guo, DJ; Ruan, SC

Xu, B; Wu, XY (reprint author), Shenzhen Univ, Shenzhen Key Lab Adv Mfg Technol Mold & Die, Shenzhen 518060, Peoples R China.

INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2017; 91 (1-4): 709