Design of Cu nanoaggregates composed of ultra-small Cu nanoparticles for Cu-Cu thermocompression bonding

Li, JJ; Liang, Q; Shi, TL; Fan, J; Gong, B; Feng, C; Fan, JH; Liao, GL; Tang, ZR

Tang, ZR (reprint author), Huazhong Univ Sci & Technol, State Key Lab Digital Mfg Equipment & Technol, Wuhan 430074, Hubei, Peoples R China.

JOURNAL OF ALLOYS AND COMPOUNDS, 2019; 772 (): 793

Abstract

In this paper, new type Cu nanoaggregates (Cu NAs) were designed, and the Cu-Cu bonding by Cu NAs was investigated. The Cu NAs were obtained by agglom......

Full Text Link


Links

期刊讨论 | 中国SCI论文 | 期刊主页 | 投稿经验 | 杂志官网 | 投稿链接 | 作者需知 | PMC链接 | Pubmed全文检索