Full-field wafer warpage measurement technique

Hsieh, HL; Lee, JY; Huang, YG; Liang, AJ; Sun, BY

Hsieh, HL (reprint author), Natl Taiwan Univ Sci & Technol, Dept Mech Engn, 43 Keelung Rd,Sec 4, Taipei 10607, Taiwan.

OPTICAL MEASUREMENT SYSTEMS FOR INDUSTRIAL INSPECTION X, 2017; 10329 ( ):

Abstract

An innovative moire technique for full-field wafer warpage measurement is proposed in this study. The wafer warpage measurement technique is developed......

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