The Method to Measure Si Thickness for Bond Line Thickness

Park, Y; Kang, K; Yun, S; Kim, S

Park, Y (reprint author), Adv Technol Inc, Incheon, South Korea.

PROCEEDINGS OF THE 7TH INTERNATIONAL CONFERENCE ON PATTERN RECOGNITION APPLICATIONS AND METHODS (ICPRAM 2018), 2018; (): 273

Abstract

Today, many semiconductor products are manufactured through the TSV process. At this time, It is important to manage the Bond Line Thickness because a......

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