Critical Dimension Bimodality Both Within Wafer and Within Die

Bhat, TS; Aggarwal, G; Yerubandi, G; Bolton, D

Bhat, TS (corresponding author), Samsung Austin Semicond, Austin, TX 78754 USA.

IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 2020; 33 (3): 487

Abstract

With reduction in the die sizes it is very critical to control the Critical Dimension (CD) within a very precise window. In this work we present a roo......

Full Text Link