Low-temperature copper-copper quasi-direct bonding with cobalt passivation layer

Wang, P; Shao, YH; Ni, ZH; Hu, CF; Qu, XP

Qu, XP (通讯作者)，Fudan Univ, Sch Microelect, State Key Lab ASIC & Syst, 220 Handan Rd, Shanghai 200433, Peoples R China.

AIP ADVANCES, 2022; 12 (11):

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