PSI Design Solutions for High Speed Die-to-Die Interface in Chiplet Applications-MedSci.cn

PSI Design Solutions for High Speed Die-to-Die Interface in Chiplet Applications

Kim, T; Moon, S; Jo, C; Nam, S; Lee, Y

Kim, T (通讯作者)，Samsung Elect Co Ltd, Foundry Business Div, Hwaseong Si, Gyeonggi Do, South Korea.

IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022), 2022; (): 2158

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