Optimal Cu paste thickness for large-area Cu-Cu joint

Wu, LM; Qian, J; Yu, JB; Guo, HJ; Chen, XP

Chen, XP (corresponding author), Chongqing Univ, Coll Optoelect Engn, Chongqing 400044, Peoples R China.; Chen, XP (corresponding author), Chongqing Univ, Key Lab Optoelect Technol & Syst, Educ Minist China, Chongqing 400044, Peoples R China.

MATERIALS LETTERS, 2021; 291 ():

Abstract

Cu paste has been considered as the most promising die-attach material for high-power devices. To investigate the influences of Cu paste layer thickne......

Full Text Link


Links

期刊讨论 | 中国SCI论文 | 期刊主页 | 投稿经验 | 杂志官网 | 投稿链接 | 作者需知 | PMC链接 | Pubmed全文检索