Electrodeposition of nanocrystalline Cu for Cu-Cu direct bonding-MedSci.cn

Electrodeposition of nanocrystalline Cu for Cu-Cu direct bonding

Jhan, JJ; Wataya, K; Nishikawa, H; Chen, CM

Chen, CM (通讯作者)，Natl Chung Hsing Univ, Dept Chem Engn, 145 Xingda Rd, Taichung 402, Taiwan.;Nishikawa, H (通讯作者)，Osaka Univ, Joining & Welding Res Inst, 11-1 Mihogaoka, Ibaraki, Osaka 5670047, Japan.

JOURNAL OF THE TAIWAN INSTITUTE OF CHEMICAL ENGINEERS, 2022; 132 ():

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