Electrical and Reliability Perspectives for Self-Forming Barrier CuSc Metallization

Cheng, YL; Peng, WF; Lee, CY; Chen, GS; Lin, YN; Fang, JS

Cheng, YL (corresponding author), Natl Chi Nan Univ, Dept Elect Engn, Nantou 54561, Taiwan.

ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, 2021; 10 (6):

Abstract

The electrical and reliability characteristics of CuSc layer on SiO2 film are reported. In an integrated CuSc/SiO2 structure, a self-forming barrier (......

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