Water-Responsive 3D Electronics for Smart Biological Interfaces

Cui, YY; Li, LZ; Liu, CB; Wang, YQ; Sun, MW; Jia, B; Shen, ZM; Sheng, X; Deng, Y

Deng, Y (通讯作者)，Beihang Univ, Res Inst Frontier Sci, Beijing 100191, Peoples R China.;Liu, CB; Deng, Y (通讯作者)，Beihang Univ, Key Lab Intelligent Sensing Mat & Chip Integrat Te, Hangzhou Innovat Inst, Hangzhou 310051, Peoples R China.;Sheng, X (通讯作者)，Tsinghua Univ, Inst Precis Med, IDG McGovern Inst Brain Res, Ctr Flexible Elect Technol,Dept Elect Engn,Beijing, Beijing 100084, Peoples R China.;Liu, CB (通讯作者)，Beihang Univ, Sch Mat Sci & Engn, Beijing 100191, Peoples R China.

NANO LETTERS, 2023; 23 (24): 11693

Abstract

Three-dimensional (3D) electronic systems with their potential for enhanced functionalities often require complex fabrication processes. This paper pr......

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