High strain rate embossing with copper plate

Wang, HM; Vivek, A; Wang, YL; Viswanathan, G; Daehn, G

Wang, HM; Daehn, G (reprint author), Ohio State Univ, Dept Mat Sci & Engn, 2041 Coll Rd, Columbus, OH 43210 USA.

INTERNATIONAL JOURNAL OF MATERIAL FORMING, 2017; 10 (5): 697

Abstract

Embossed parts, that contain a number of features, are desired for a range of components, such as, heat exchangers, bipolar plates, micro-reactors, an......

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