Wetting balance test - comparison of solder alloys wetting

Busek, D; Placek, M; Ruzicka, D

Busek, D (reprint author), Czech Tech Univ, Fac Elect Engn, Dept Electrotechnol, Tech 2, Prague 16627 6, Czech Republic.

2017 40TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE), 2017; ( ):

Abstract

The article deals with wetting balance method comparison of solderability of the following materials combinations: two lead free solder alloys (Sn99Cu......

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