Research on virtual haptic disassembly platform considering disassembly process

Yang, YF; Yang, P; Li, J; Zeng, F; Yang, M; Wang, R; Bai, Q

Yang, YF (reprint author), Wuhan Univ Technol, Sch Logist Engn, Wuhan, Hubei, Peoples R China.

NEUROCOMPUTING, 2019; 348 (): 74

Abstract

The speed of equipment repair and maintenance becomes a key factor in improving the production efficiency. Though the process of equipment disassembly......

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