Copper-Copper Ultrasonic Bonding by Using Blue Laser-Sintered Copper Nanoparticles

Kishida, S; Takada, Y; Yinan, Z; Song, JM; Yasuda, K

Yasuda, K (通讯作者)，Osaka Univ, Grad Sch Engn, Div Mat & Mfg Sci, Suita, Osaka 5650871, Japan.

2022 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP 2022), 2022; (): 61

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