A Hybrid Panel Level Package (Hybrid PLP) Technology Based on a 650-mm x 650-mm Platform-MedSci.cn

A Hybrid Panel Level Package (Hybrid PLP) Technology Based on a 650-mm x 650-mm Platform

O'Toole, E; Silva, JL; Cardoso, F; Silva, J; Alves, L; Souto, M; Delduque, N; Coelho, A; Silva, JM; Do, W; Khim, J

O'Toole, E (通讯作者)，Amkor Technol, Vila Do Conde, Portugal.

IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022), 2022; (): 824

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