Signal/Power Integrity Co-Simulation of Die-to-Die Interface Customized for Augmented Reality

Hashemi, A; Yamaguchi, K; Bozorgzadeh, B; Jiang, L; Manjunath, H; Ahmadi, MR; Beyene, W

Hashemi, A (通讯作者)，Meta Platforms Inc, Real Labs, Sunnyvale, CA 94085 USA.

2023 IEEE 32ND CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS, EPEPS, 2023; ():

Abstract

There is a rising demand for customized accelerate-and-compute hardware in emerging augmented reality (AR) and virtual reality (VR) wearables to enabl......

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