System in package (SiP) technology: fundamentals, design and applications

Santagata, F; Sun, JW; Iervolino, E; Yu, HY; Wang, F; Zhang, GQ; Sarro, PM; Zhang, GY

Santagata, F (reprint author), Peking Univ, Dongguan Inst Optoelect, Beijing, Peoples R China.; Santagata, F (reprint author), Guangdong Dongguan Qual Supervis Testing Ctr, Dongguan, Peoples R China.

MICROELECTRONICS INTERNATIONAL, 2018; 35 (4): 231

Abstract

Purpose - The purpose of this paper is to demonstrate a novel 3D system-in-package (SiP) approach. This new packaging approach is based on stacked sil......

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