Fabrication of sinter-free conductive Cu paste using sub-10 nm copper nanoparticles

Lee, J; Jun, J; Na, W; Oh, J; Kim, Y; Kim, W; Jang, J

Jang, J (reprint author), Seoul Natl Univ, Sch Chem & Biol Engn, 599 Gwanangno, Seoul 151742, South Korea.

JOURNAL OF MATERIALS CHEMISTRY C, 2017; 5 (47): 12507

Abstract

We herein describe the fabrication of sinter-free copper nanoparticle-based conductive paste (Cu NP paste). The copper nanoparticles with a size below......

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