Improved thermal network modeling of die stacking DRAM and optimization

Li, MT; Li, TJ; Tang, YQ

Li, TJ (通讯作者)，Xidian Univ, Sch Mechano Elect Engn, Xian 710071, Peoples R China.

INTEGRATION-THE VLSI JOURNAL, 2022; 85 (): 35

Abstract

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