Plasma-Activated Cu-Cu Direct Bonding in Ambient for Die-Die and Die-Wafer Bonding-MedSci.cn

Plasma-Activated Cu-Cu Direct Bonding in Ambient for Die-Die and Die-Wafer Bonding

Hu, LX; Lim, YD; Zhao, P; Lim, MJZ; Tan, CS

Hu, LX (通讯作者)，Nanyang Technol Univ, Sch Elect & Elect Engn, Singapore, Singapore.

6TH IEEE ELECTRON DEVICES TECHNOLOGY AND MANUFACTURING CONFERENCE (EDTM 2022), 2022; (): 276

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