Intermetallics evolution and its reliability effects on micro-joints in flip chip assemblies

Tian, Y; Fang, H; Ren, N; Qiu, C; Chen, F; Sitaraman, S

Qiu, C (corresponding author), Henan Univ Technol, Sch Mech & Elect Engn, Zhengzhou, Peoples R China.

MICROELECTRONICS INTERNATIONAL, 2020; 37 (3): 117

Abstract

Purpose This paper aims to assess precise correlations between intermetallic compounds (IMCs) microstructure evolutions and the reliability of micro-j......

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