A new ultrasonic electrochemical potential activation method to enhance the adhesion strength between electroforming layer and Cu substrate

Zhao, Z; Zhang, Q; Zhu, PC

Zhao, Z (corresponding author), Jiangsu Univ Sci & Technol, Sch Mech Engn, Zhenjiang, Jiangsu, Peoples R China.

JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, ; ():

Abstract

In Micro-Electro-Mechanical System (MEMS) area, micro metal devices can be fabricated by the micro electroforming process. However, due to the oxide l......

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