The Effect of Cu2+ Ions and Glycine Complex on Chemical Mechanical Polishing (CMP) Performance of SiC Substrates

Zhang, P; Chen, GM; Ni, ZF; Wang, YG; Teng, K; Qian, SH; Bian, D; Zhao, Y

Ni, ZF (corresponding author), Jiangnan Univ, Sch Mech Engn, Wuxi 214122, Jiangsu, Peoples R China.

TRIBOLOGY LETTERS, 2021; 69 (3):

Abstract

In order to obtain a high material removal rate and good surface quality, the effect of Cu2+ ions and glycine complex as a catalyst on the chemical me......

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