Jumping-droplet electronics hot-spot cooling

Oh, J; Birbarah, P; Foulkes, T; Yin, SL; Rentauskas, M; Neely, J; Pilawa-Podgurski, RCN; Miljkovic, N

Miljkovic, N (reprint author), Univ Illinois, Dept Mech Sci & Engn, Urbana, IL 61801 USA.; Pilawa-Podgurski, RCN (reprint author), Univ Illinois, Dept Elect & Comp Engn, Urbana, IL 61801 USA.; Miljkovic, N (reprint author), Kyushu Univ, Int Inst Carbon Ne

APPLIED PHYSICS LETTERS, 2017; 110 (12):

Abstract

Demand for enhanced cooling technologies within various commercial and consumer applications has increased in recent decades due to electronic devices......

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