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Single Event Upset Evaluation for a 28-nm FDSOI SRAM Type Buffer in an ARM Processor

期刊: JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS, 2021; 37 (2)

A triple modular redundancy SRAM was designed as the embedded high-speed memory for a radiation-tolerant ARM processor with ST Microelectronics 28-nm ......

Radiation Tolerant SRAM Cell Design in 65nm Technology

期刊: JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS, 2021; 37 (2)

In this paper, eight different SRAM cells are studied and evaluated with a 65nm CMOS technology. The cells were designed with radiation-hardening-by-d......

Fault Diagnosis Method of Low Noise Amplifier Based on Support Vector Machine and Hidden Markov Model

期刊: JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS, 2021; 37 (2)

Radio Frequency (RF) analog circuit failures often occur in broadband, high voltage and high temperature environment, so how to determine fault locati......

Method of Implanting Hardware Trojan Based on EHW in Part of Circuit

期刊: JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS, 2021; 37 (2)

In view of the fact that the traditional Hardware Trojan (HT) implanting method will increase the number of logic gates, and the power consumption cha......

Single Particle Fault Injection Signal Generation Method Using Gaussian Cloud Model

期刊: JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS, 2021; 37 (1)

In the traditional single particle fault injection experiments (SPFIE), when the target configuration register for fault injection is selected, the st......

On-Line Test of Pin-Constrained Digital Microfluidic Biochips with Connect-5 Structure

期刊: JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS, ; ()

Digital microfluidic biochips (DMFBs) are widely used in the field of biochemistry. Effective off-line and on-line test for the biochips are required ......

Model Transferability from ImageNet to Lithography Hotspot Detection

期刊: JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS, ; ()

Detecting lithographic hotspots is significant for VLSI fabrication before transferring the designed circuit layout pattern to silicon. However, the c......

Diagnosis of Incipient Faults in Nonlinear Analog Circuits Based on High Order Moment Fractional Transform

期刊: JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS, 2020; 36 (4)

Considering the problem to diagnose incipient faults in nonlinear analog circuits, a novel approach of fault feature-extracting based on HMFT (high or......

An Analytic Model for Predicting Single Event (SE) Crosstalk of Nanometer CMOS Circuits

期刊: JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS, 2020; 36 (4)

With the technology node scaling down into nanometer range, the effect of parasitic inductance and capacitance between the interconnect lines on predi......

Soft Error Reliability Evaluation of Nanoscale Logic Circuits in the Presence of Multiple Transient Faults

期刊: JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS, 2020; 36 (4)

Radiation-induced single transient faults (STFs) are expected to evolve into multiple transient faults (MTFs) at nanoscale CMOS technology nodes. For ......

Role of the Pulse Repetition Rate when Assessing Electromagnetic Immunity of Electronic Devices

期刊: JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS, 2020; 36 (5)

Considering the shortcomings of the existing test methods, this paper provides a new procedure for validating the requirements on the repetition rate ......

Part I: Evaluation for Hardware Trojan Detection Based on Electromagnetic Radiation

期刊: JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS, 2020; 36 (5)

Hardware Trojan (HT) is increasingly becoming a major threat in the filed of hardware security. Recently, researchers are taking a high value on the s......

Optimal Selection of Tests for Fault Diagnosis in Multi-Path System with Time-delay

期刊: JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS, 2020; 36 (1)

Test selection is an important process to simplify the system structure and build a diagnostic system. Test selection problem in a multi-path system w......

Detection and Diagnosis of Multi-Fault for through Silicon Vias in 3D IC

期刊: JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS, 2020; 36 (6)

Through silicon via (TSV) is the enabling technology for three-dimensional integrated circuit (3D IC) realization. During the TSV manufacturing proces......

An Efficient Algorithm for Optimizing the Test Path of Digital Microfluidic Biochips

期刊: JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS, 2020; 36 (2)

Digital microfluidic biochips (DMFBs) have been widely used in biochemical experiments with high safety requirements. To ensure the reliability of the......

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