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JOURNAL OF ELECTRONIC PACKAGING

出版年份:暂无数据 年文章数:1041 投稿命中率: 开通期刊会员,数据随心看

出版周期:Quarterly 自引率:18.6% 审稿周期: 开通期刊会员,数据随心看

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投稿信息
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中国人发表比例
2023年中国人文章占该期刊总数量暂无数据 (2022年为100.00%)
自引率
18.6 %
年文章数
1041
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作者需知
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偏重的研究方向
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期刊简介
稿件收录要求
This journal publishes papers that use experimental and theoretical (analytical and coputer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic, optoelectronics, and photonics components, devices, and systems. Originally, practicality, high engineering level, and mechanical (materials) orientation are the major criteria for the acceptance of a submitted paper.