Search Page
Save citations to file
Email citations
Send citations to clipboard
Add to Collections
Add to My Bibliography
Create a file for external citation management software
Your saved search
Your RSS Feed
Filters
Results by year
Table representation of search results timeline featuring number of search results per year.
Year | Number of Results |
---|---|
2013 | 2 |
2016 | 1 |
2024 | 0 |
Search Results
3 results
Results by year
Filters applied: . Clear all
Page 1
Effect of Indium Content on the Melting Point, Dross, and Oxidation Characteristics of Sn-2Ag-3Bi-xIn Solders.
J Electron Packag. 2013 Jun;135(2):0210061-210065. doi: 10.1115/1.4023529. Epub 2013 Mar 28.
J Electron Packag. 2013.
PMID: 24891810
Free PMC article.
A Study on Electrical Reliability Criterion on Through Silicon Via Packaging.
Lwo BJ, Tseng KH, Tseng KF.
Lwo BJ, et al.
J Electron Packag. 2016 Jun;138(2):0245011-245015. doi: 10.1115/1.4032932. Epub 2016 Mar 23.
J Electron Packag. 2016.
PMID: 27222634
Free PMC article.
Item in Clipboard
Reliability Assessment and Activation Energy Study of Au and Pd-Coated Cu Wires Post High Temperature Aging in Nanoscale Semiconductor Packaging.
Gan CL, Hashim U.
Gan CL, et al.
J Electron Packag. 2013 Jun;135(2):0210101-210107. doi: 10.1115/1.4024013. Epub 2013 Apr 12.
J Electron Packag. 2013.
PMID: 24891811
Free PMC article.
Item in Clipboard
Cite
Cite