Performance of WCN diffusion barrier for Cu multilevel interconnects

Lee, SY; Ju, BK; Kim, YT

Kim, YT (reprint author), Korea Inst Sci & Technol, Semicond Mat & Devices Lab, Seoul 02792, South Korea.; Ju, BK (reprint author), Korea Univ, Coll Engn, Display & Nanosyst Lab, Seoul 139701, South Korea.

JAPANESE JOURNAL OF APPLIED PHYSICS, 2018; 57 (4):

Abstract

The electrical and thermal properties of a WCN diffusion barrier have been studied for Cu multilevel interconnects. The WCN has been prepared using an......

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